Fabrication of conductive structures in volumetric additive manufacturing through embedded 3-D printing for electronic applications

IF 4.2 Q2 ENGINEERING, MANUFACTURING
Anders Frem Wolstrup , Jonathan Thorbjørn Dagnæs-Hansen , Oskar Vitus Brandt , Daniel Helmuth Meile , Carl Sander Kruse , Jon Spangenberg , Tiberiu Gabriel Zsurzsan
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引用次数: 0

Abstract

This study investigates the fabrication of conductive structures for electronics applications using embedded 3-D printing coupled with Volumetric Additive Manufacturing (VAM). Electrically conductive carbon grease was suspended within a resin matrix, and the samples underwent VAM printing and post-processing. The resulting three dimensional conductive structure was measured to have a resistance of 4.5 kΩ, corresponding well with the material specifications. The results showed the importance of complete encapsulation of the conductive material within the resin to preserve the conductive structure. The resistivity of the conductive grease remained unaffected, indicating no interaction with the resin. Potential enhancements to improve the structure's fidelity and broaden its range of applications is discussed. This research highlights the potential of embedded 3-D printing for fabricating conductive structures in VAM. The fabrication method allows for unprecedented avenues in developing electronic applications, such as smart sensing, smart drug delivery and cyborganics.

Abstract Image

基于嵌入式3d打印的导电结构在体积增材制造中的应用
本研究探讨了利用嵌入式3d打印与体积增材制造(VAM)相结合的电子应用导电结构的制造。导电碳脂悬浮在树脂基体中,样品经过VAM打印和后处理。测量所得三维导电结构的电阻为4.5 kΩ,与材料规格相符合。结果表明,在树脂中完全封装导电材料对于保持导电结构的重要性。导电润滑脂的电阻率未受影响,表明与树脂没有相互作用。讨论了提高结构保真度和扩大其应用范围的潜在改进。这项研究突出了嵌入式3d打印在VAM中制造导电结构的潜力。这种制造方法为开发电子应用提供了前所未有的途径,如智能传感、智能药物输送和电子生物。
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来源期刊
Additive manufacturing letters
Additive manufacturing letters Materials Science (General), Industrial and Manufacturing Engineering, Mechanics of Materials
CiteScore
3.70
自引率
0.00%
发文量
0
审稿时长
37 days
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