Electrodeposition of Co-Ni nanostructures

Abstract

Co-Ni films are widely used in electronics industry for their excellent magnetic, mechanical and electrical properties. In this work, the influence of substrate type and deposition parameters on the morphologies of electroplating Co-Ni nanostructures was investigated. It was found that scallop shell-like Co-Ni depositions could be fabricated on copper wafers. The tendency to form the scallop shell-like depositions increased with increase of deposition time and current density. While on silicon wafers, scallop shell-like Co-Ni depositions could not form. Only acupuncture-like nanostructures could be fabricated on silicon wafers at a high current density.