Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI:10.1109/ICEPT.2016.7583298

Jia-Qiang Huang, Min-bo Zhou, Wang-yun Li, Xin-Ping Zhang

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Abstract

Size effect of solder balls on the interfacial reaction and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints during isothermal aging at 125 °C was systematically investigated. Results show that a large amount of bulk Cu6Sn5 phase distributes in the solder matrix of joints with large solder ball size, resulting from larger outflux Cu atoms from the interface to the molten solder and the low solubility of Cu in the solder matrix. The solder ball size has a significant influence on the interfacial Cu6Sn5 layer thickness at the Sn3.0Ag0.5Cu-ball/Cu interface, which increases with decreasing solder ball size, while showing less effect on that at the Sn3.0Ag0.5Cu-paste/Cu interface. The grain size of Ag3Sn phase in joints decreases with decreasing solder ball size. During isothermal aging, the growth of interfacial IMC layers at both Sn3.0Ag0.5Cu-ball/Cu and Sn3.0Ag0.5Cu-paste/Cu interfaces of joints is mainly controlled by bulk diffusion.

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尺寸效应对BGA封装倒装芯片中Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu接头界面反应及微观结构演变的影响

系统研究了125℃等温时效过程中，焊料球尺寸对BGA结构Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu接头界面反应和微观组织演变的影响。结果表明:当焊锡球尺寸较大时，由于Cu原子从界面向钎料流出量较大，且Cu在钎料基体中的溶解度较低，导致大量的块状Cu6Sn5相分布在钎料基体中;钎料球尺寸对Sn3.0Ag0.5Cu-ball/Cu界面Cu6Sn5层厚度的影响显著，随钎料球尺寸的减小而增大，而对Sn3.0Ag0.5Cu-paste/Cu界面Cu6Sn5层厚度的影响较小。随着焊料球尺寸的减小，接头中Ag3Sn相的晶粒尺寸减小。在等温时效过程中，Sn3.0Ag0.5Cu-ball/Cu和Sn3.0Ag0.5Cu-paste/Cu界面IMC层的生长主要受体扩散控制。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2016 17th International Conference on Electronic Packaging Technology (ICEPT)

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