How to secure the fabrication of Gallium Nitride on Si wafers

D. Alliata, N. Anderson, M. Durand de Gevigney, I. Bergoend, P. Gastaldo
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Abstract

Process control solutions to secure the High-Volume Manufacturing of Gallium Nitride (GaN) devices for power applications are a must today. Unity recently developed and introduced on the market a total control solution that address both defectivity and metrology needs of GaN industry. Proprietary technologies like Phase Shift Deflectometry, darkfield inspection, confocal chromatic imaging and infrared interferometry are here explored to detect killer defects potentially affecting the gallium nitride wafer. More in detail, we characterized Gallium nitride on Silicon substrate before and after the fabrication of the final device and demonstrated how the fabrication process can be optimized.
如何确保氮化镓在硅晶片上的制备
如今,确保大功率应用中氮化镓(GaN)器件的大批量生产的过程控制解决方案是必须的。Unity最近开发并在市场上推出了一个全面的控制解决方案,解决了氮化镓行业的缺陷和计量需求。本文探讨了相移偏转法、暗场检测、共聚焦色差成像和红外干涉测量等专有技术,以检测可能影响氮化镓晶圆的致命缺陷。更详细地说,我们在最终器件制造前后对硅衬底上的氮化镓进行了表征,并演示了如何优化制造工艺。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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