Incorporation of a β-AgVO3 Semiconductor in Resin Cement: Evaluation of Mechanical Properties and Antibacterial Efficacy.

Simone Kreve, André Luís Botelho, Mariana Lima da Costa Valente, Luciano Bachmann, Marco Antônio Schiavon, Andréa C Dos Reis
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Abstract

Purpose: This in vitro study aimed to investigate the effect of incorporating the semiconductor nanostructured silver vanadate decorated with silver nanoparticles (β-AgVO3) in a dual-cure resin cement on the degree of conversion (DC), microhardness, roughness, color, adhesion properties before and after artificial aging, and antimicrobial efficacy.

Material and methods: Three test groups were established: control (without β-AgVO3), with the incorporation of 2.5% and 5% (by weight) of β-AgVO3 in dual-cure resin cement (Allcem, FGM). The degree of conversion was measured using Fourier transform infrared spectroscopy (FTIR). To evaluate roughness (n = 10), microhardness (n = 10), color (n = 10), and to perform agar disk diffusion (n = 8), disks of 6-mm diameter and 2-mm height were manufactured using the same concentrations. For the color and shear bond strength test (n = 6), orthodontic brackets (Morelli) were used, which were cemented to natural human enamel and evaluated before and after artificial aging via thermocycling at 5°C and 55°C for 1000 cycles. For color measurements, a portable spectrocolorimeter and the CIE-Lab method were used. Data were analyzed using Student's t-test, ANOVA, and Tukey's multiple comparisons with significance set at α = 0.05.

Results: Semiconductor incorporation did not influence the cements's DC. The incorporation of 2.5% and 5% of β-AgVO3 resulted in a significant increase in Knoop microhardness and surface roughness. Significant changes were observed in the color of the specimens when the semiconductor was incorporated. Adhesion after aging remained within the clinically recommended values in all groups, and antimicrobial activity was observed against Staphylococcus aureus, Streptococcus mutans, and Enterococcus faecalis at both concentrations tested.

Conclusion: It is suggested to incorporate the semiconductor β-AgVO3 in the dual-cure resin cement at both concentrations. Moreover, the physical-mechanical properties remained satisfactory for the proposed application.

在树脂水泥中加入 β-AgVO3 半导体:机械性能和抗菌功效评估
目的:本体外研究旨在探讨在双固化树脂水门汀中掺入装饰有银纳米颗粒的半导体纳米结构钒酸银(β-AgVO3)对人工老化前后的转化率(DC)、微硬度、粗糙度、颜色、粘接性能以及抗菌效果的影响:设立三个试验组:对照组(不含 β-AgVO3)、在双固化树脂水泥(Allcem,FGM)中掺入 2.5% 和 5%(按重量计)β-AgVO3 的试验组。采用傅立叶变换红外光谱法(FTIR)测量转化程度。为了评估粗糙度(n = 10)、显微硬度(n = 10)、颜色(n = 10)和进行琼脂盘扩散(n = 8),使用相同浓度制造了直径 6 毫米、高 2 毫米的盘。在色泽和剪切粘接强度测试中(n = 6),使用了正畸托槽(莫瑞利),将其粘接在天然人体珐琅质上,并通过在 5°C 和 55°C 下进行 1000 个循环的热循环,在人工老化前后对其进行评估。颜色测量采用便携式分光测色计和 CIE-Lab 方法。数据分析采用学生 t 检验、方差分析和 Tukey 多重比较,显著性设定为 α = 0.05:结果:半导体的掺入不会影响水泥的直流电。掺入 2.5% 和 5% 的 β-AgVO3 会显著增加努氏显微硬度和表面粗糙度。加入半导体后,试样的颜色发生了显著变化。所有组别老化后的附着力都保持在临床推荐值范围内,在两种测试浓度下都观察到了对金黄色葡萄球菌、变异链球菌和粪肠球菌的抗菌活性:结论:建议在双固化树脂水门汀中加入两种浓度的半导体 β-AgVO3。此外,其物理机械性能仍能满足拟议应用的要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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