Reliability and microstructural studies of Sn-Ag-Cu lead-free solder joints in pulse-heated reflow soldering

M. Mostofizadeh, K. Kokko, L. Frisk
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Abstract

With the advent of miniaturization in the electronics industry, the application of flexible interconnections has become necessary and inevitable for many new designs such as flexible circuits (flex) to printed circuit boards (PCB), flex to flex, and multiwire to PCB. Pulse-heated reflow soldering is demonstrably a reliable and repeatable soldering process for manufacturing such products, especially in the attachment of flex-to-PCB in the electronics industry. This paper reports on the microstructure and reliability of flex-to-PCB solder joints. Flex-to-PCB samples were made using Pulse-heated reflow soldering and conventional reflow oven soldering. To study the reliability of the solder joints, three different environmental tests were conducted including thermal shock, thermal humidity, and thermal aging. Microstructural studies and failure analysis were performed on all samples before and after the reliability tests in order to ascertain the cause of failure in both bonding methods. Additionally, a comparison of both attachment methods comprising pulse-heated reflow soldering and reflow oven is presented demonstrating their applicability in manufacturing flex-to-PCB assemblies.
脉冲加热回流焊Sn-Ag-Cu无铅焊点的可靠性和显微组织研究
随着电子工业小型化的到来,柔性互连的应用已成为许多新设计的必要和不可避免的,例如柔性电路(挠性)到印刷电路板(PCB),挠性到挠性,多线到PCB。脉冲加热回流焊显然是制造此类产品的可靠且可重复的焊接工艺,特别是在电子工业中柔性到pcb的附件中。本文报道了柔性- pcb焊点的微观结构和可靠性。采用脉冲加热回流焊和常规回流炉焊接两种方法制备柔性- pcb样品。为了研究焊点的可靠性,进行了热冲击、热湿度和热老化三种不同的环境试验。在可靠性试验前后对所有试样进行了显微组织研究和失效分析,以确定两种粘结方法失效的原因。此外,还比较了两种连接方法,包括脉冲加热回流焊和回流炉,证明了它们在制造柔性到pcb组件中的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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