{"title":"Surface Characterization and Leadframe-to-Mold Adhesion Performance of Oxidation-Roughened Leadframes","authors":"Matthew M. Fernandez, Richard Jan C. Malifer","doi":"10.1109/EPTC50525.2020.9315090","DOIUrl":null,"url":null,"abstract":"Leadframe surface roughening increases the leadframe-to-mold interfacial adhesion strength through mechanical locking and free-radical bonding mechanism. On this study, two different oxidation-roughened leadframes were successfully evaluated through leadframe surface characterization and leadframe-to-mold adhesion performance. Leadframe surface morphology characterization showed that both Leadframes have the same needle-like microstructure at zero-hour. After high temperature anneal, Leadframe A evolved into coarser structure while Leadframe B remains stable. Hypothesis tests confirmed that Leadframe B have higher surface stability than the Leadframe A upon exposure to high temperature annealing process. Leadframe-to-mold adhesion performance through Button Shear Test revealed that mold adhesion strength of Leadframe B is consistently higher than Leadframe A at Ag and Cu regions. Hypothesis tests also confirmed that Leadframe B have stable shear strength upon exposure to high temperature annealing process while Leadframe A showed a significant degradation of shear strength after annealing process. The leadframe-to-mold adhesion performance through SAM showed that the Leadframe B has better Leadframe-to-mold adhesion than the leadframe A. The mold adhesion improvements can be attributed to the microstructural and roughness stability of the surface. Leadframe B showed stable microstructure upon exposure to high temperature annealing process resulted to high and stable mold shear strength and leadframe-to-mold adhesion.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"36 1","pages":"116-120"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC50525.2020.9315090","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Leadframe surface roughening increases the leadframe-to-mold interfacial adhesion strength through mechanical locking and free-radical bonding mechanism. On this study, two different oxidation-roughened leadframes were successfully evaluated through leadframe surface characterization and leadframe-to-mold adhesion performance. Leadframe surface morphology characterization showed that both Leadframes have the same needle-like microstructure at zero-hour. After high temperature anneal, Leadframe A evolved into coarser structure while Leadframe B remains stable. Hypothesis tests confirmed that Leadframe B have higher surface stability than the Leadframe A upon exposure to high temperature annealing process. Leadframe-to-mold adhesion performance through Button Shear Test revealed that mold adhesion strength of Leadframe B is consistently higher than Leadframe A at Ag and Cu regions. Hypothesis tests also confirmed that Leadframe B have stable shear strength upon exposure to high temperature annealing process while Leadframe A showed a significant degradation of shear strength after annealing process. The leadframe-to-mold adhesion performance through SAM showed that the Leadframe B has better Leadframe-to-mold adhesion than the leadframe A. The mold adhesion improvements can be attributed to the microstructural and roughness stability of the surface. Leadframe B showed stable microstructure upon exposure to high temperature annealing process resulted to high and stable mold shear strength and leadframe-to-mold adhesion.