Advanced Air Gap Formation Scheme Using Volatile Material

Abstract

As a solution for RC delay of BEOL interconnect, we developed a novel air gap formation scheme. This scheme uses a volatile material (VM) and allows us to omit one lithography step, which was required for conventional air gap formation. It is possible to apply this scheme to subtractive interconnect scheme too. In this study, we will introduce the basic characteristics of VM and demonstrate the novel air gap integration through e-tests.