Unipolar barrier-integrated HgCdTe infrared detectors

A. Itsuno, J. Phillips, S. Velicu
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引用次数: 1

Abstract

HgCdTe-based infrared (IR) detectors remain the front-runner for high performance IR focal plane array (FPA) applications due to their favorable material and optical properties. While state-of-the-art HgCdTe p-n junction technology such as the double layer planar heterostructure (DLPH) devices can achieve near theoretical performance in the mid-wave and long-wave infrared (MWIR, LWIR) spectral ranges, the cryogenic cooling requirements to suppress dark current are still much greater than desired. HgCdTe material growth by molecular beam epitaxy (MBE) provides the accurate control over alloy composition and doping required to achieve future detector architectures that may serve to reduce dark current for enhanced operation. However, controllable in situ p-type doping of HgCdTe by MBE is still problematic. As a potential solution to address these issues, we propose a unipolar, type-I barrier-integrated HgCdTe nBn IR detector based on similar principles to the type-II nBn structure used in III-V materials [1] with the intent that it may serve as a basis for advanced HgCdTe-based architectures for reduced cooling requirements.
单极势垒集成HgCdTe红外探测器
基于碲化汞的红外(IR)探测器由于其良好的材料和光学特性,仍然是高性能红外焦平面阵列(FPA)应用的领跑者。虽然最先进的HgCdTe p-n结技术(如双层平面异质结构(DLPH)器件)可以在中波和长波红外(MWIR, LWIR)光谱范围内实现接近理论的性能,但抑制暗电流的低温冷却要求仍然远远大于期望。通过分子束外延(MBE)生长的HgCdTe材料提供了对合金成分和掺杂所需的精确控制,以实现未来的探测器架构,可能有助于减少暗电流以增强操作。然而,利用MBE原位可控p型掺杂HgCdTe仍然是一个问题。作为解决这些问题的潜在解决方案,我们提出了一种单极,i型势垒集成的HgCdTe nBn红外探测器,其原理与III-V材料中使用的ii型nBn结构相似[1],目的是它可以作为先进的基于HgCdTe的架构的基础,以降低冷却要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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