J. Silomon, J. Gluch, J. Posseckardt, A. Clausner, J. Paul, D. Breuer, E. Zschech
{"title":"BEoL Damage Evaluation Utilizing Sub-Critical Cu-Pillar Shear Tests, Acoustic Emission, nXCT, and SEM/FIB Analysis","authors":"J. Silomon, J. Gluch, J. Posseckardt, A. Clausner, J. Paul, D. Breuer, E. Zschech","doi":"10.1109/IITC51362.2021.9537376","DOIUrl":null,"url":null,"abstract":"In previous works, the resulting damages in the back end of line (BEoL) stack triggered by Copper pillar (Cu-pillar) shear-off events were evaluated and classified [1]. It was determined, especially by utilizing acoustic emission (AE) measurements, that damage events consist of multiple extremely fast sub-processes. The objective of this work is the development of an approach to enable the identification of the areas of damage initiation and comprehend the damage propagation in a BEoL stack under mechanical load by triggering only the initial sub-processes. Mechanical stress was induced into the BEoL stack utilizing a displacement-controlled sub-critical Cu-pillar loading approach with the approximate parametrization determined in previous experiments [1]. During mechanical loading, AE signals were constantly measured. As soon as significant acoustic events were detected, the experiment was aborted. The occurring damages were analyzed utilizing a customized nano X-ray computed tomography (nXCT) setup and focused ion beam (FIB) milling as well as scanning electron microscopy (SEM) imaging. In this work, a methodology could be developed to enable the evaluation of BEoL damages in an early, sub-critical stage. These results provide a better understanding of the damage formation and propagation in the BEoL stack and enable a design optimization procedure for the most damage prone areas.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537376","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
In previous works, the resulting damages in the back end of line (BEoL) stack triggered by Copper pillar (Cu-pillar) shear-off events were evaluated and classified [1]. It was determined, especially by utilizing acoustic emission (AE) measurements, that damage events consist of multiple extremely fast sub-processes. The objective of this work is the development of an approach to enable the identification of the areas of damage initiation and comprehend the damage propagation in a BEoL stack under mechanical load by triggering only the initial sub-processes. Mechanical stress was induced into the BEoL stack utilizing a displacement-controlled sub-critical Cu-pillar loading approach with the approximate parametrization determined in previous experiments [1]. During mechanical loading, AE signals were constantly measured. As soon as significant acoustic events were detected, the experiment was aborted. The occurring damages were analyzed utilizing a customized nano X-ray computed tomography (nXCT) setup and focused ion beam (FIB) milling as well as scanning electron microscopy (SEM) imaging. In this work, a methodology could be developed to enable the evaluation of BEoL damages in an early, sub-critical stage. These results provide a better understanding of the damage formation and propagation in the BEoL stack and enable a design optimization procedure for the most damage prone areas.