Ultra-wide band gap materials for high frequency applications

T. Razzak, H. Xue, Zhanbo Xia, Seongmo Hwang, Asif Khan, W. Lu, S. Rajan
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引用次数: 5

Abstract

Gallium Nitride electronics based on the AlGaN/GaN high electron mobility transistor structure is approaching intrinsic limits. Future mm-wave and THz technology requires highly efficient and linear amplifiers that can deliver high power density. This presentation will outline the potential and recent work of next-generation wide band gap transistors based on ultra-wide band gap semiconductors for high frequency applications. Detailed DC and high frequency 2-dimensional modeling of ultra-wide band gap semiconductor devices show that the predicted power density, gain, and efficiency of these devices have the potential to be better than cutting-edge GaN-based devices at mm-wave and THz frequencies. We will discuss the principal challenges for realization of these devices and outline the design and demonstration of advanced high Al-composition AlGaN based transistors, where researchers have used novel epitaxial designs to enable efficient injection and extraction of carriers. This has enabled the state-of-the-art current density and breakdown characteristics of AlGaN-channel devices to increase significantly in recent years.
用于高频应用的超宽带隙材料
基于氮化镓/氮化镓高电子迁移率晶体管结构的氮化镓电子学正接近内在极限。未来的毫米波和太赫兹技术需要能够提供高功率密度的高效线性放大器。本报告将概述基于高频应用的超宽带隙半导体的下一代宽带隙晶体管的潜力和最新工作。超宽带隙半导体器件的详细直流和高频二维建模表明,这些器件的预测功率密度、增益和效率有可能在毫米波和太赫兹频率下优于尖端的gan基器件。我们将讨论实现这些器件的主要挑战,并概述先进的高铝成分AlGaN基晶体管的设计和演示,其中研究人员已经使用新颖的外延设计来实现高效的注入和提取载流子。这使得近年来algan通道器件的电流密度和击穿特性显著增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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