Interfacial Microstructure and Mechanical Behavior of Low-Temperature Diffusion Bonded Mo/SS304 Joints Using Ni xCu 1-x Interlayers

Ming-yong Jia, Fei Chen, Lei Zhang, Zhifeng Huang, Q. Shen
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引用次数: 1

Abstract

To join dissimilar metals with large differences in characteristics, such as molybdenum (Mo) and stainless steels (SS), is essential to take full advantage of their combined performances. In this work, Mo and SS304 have been jointed with Ni interlayer by using a diffusion bonding technique at different bonding temperatures. The results show that a MoNi brittle intermetallic compound is easy to form in the interface of the Mo/SS304 joint with increasing the bonding temperature, which will reduce the shear strength of the joint because a crack is easy to form between Mo and the intermetallic compounds. Meanwhile, Mo/SS304 joints have also been prepared by using NixCu1-x (x=0.45, 0.24, or 0) as an interlayer. The result shows that reducing Ni content can avoid the formation of intermetallic compounds, and the fracture occurs between the interlayer and Mo diffusion zone far away from the Mo side. This work shows that the fracture properties of the Mo/SS304 joint can be modified by changing the composition of the interlayer. The best shear strength of the Mo/SS304 joint is 140 MPa. This work is important for providing an effective approach to join Mo and SS304 using a low-temperature diffusion bonding method.
Ni xCu 1-x夹层Mo/SS304低温扩散连接接头的微观组织和力学行为
为了充分利用它们的综合性能,将具有很大特性差异的不同金属,如钼(Mo)和不锈钢(SS)连接起来是必不可少的。本文采用扩散键合技术,在不同的键合温度下,将Mo和SS304与Ni中间层进行了连接。结果表明:随着结合温度的升高,Mo/SS304接头界面容易形成MoNi脆性金属间化合物,Mo与金属间化合物之间容易形成裂纹,从而降低了接头的抗剪强度;同时,还采用NixCu1-x (x=0.45, 0.24,或0)作为中间层制备了Mo/SS304接头。结果表明,降低Ni含量可以避免金属间化合物的形成,断裂发生在层间和远离Mo一侧的Mo扩散区之间。研究表明,通过改变中间层的组成可以改变Mo/SS304接头的断裂性能。Mo/SS304接头的最佳抗剪强度为140 MPa。这项工作对于提供一种低温扩散连接Mo和SS304的有效方法具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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