Effects of thermal aging and electromigration on tensile strength of SnAgCu solder joints with different volume

Abstract

The effects of thermal aging and electromigration on the tensile strength and microstructure of SnAgCu micro-interconnection solder joints with different volume were discussed in this paper. The experimental results show that isothermal aging results in coarsening of the microstructure in the solder joint, and electromigration leads to micro-hole or micro-crack in the cathode interface, which bring about obvious degradation of tensile strength to the joints. The smaller volume of the micro-interconnection joint is, the less degradation of tensile strength for it, this is caused by the increasing mechanical constraint in the solder joints.