Reliability of 20µm pitch NCF type COF package with compliant-bump

Abstract

In this study, three kinds of NCF adhesives named as NCF I, NCF II and NCF III, were applied to COF package with compliant-bump. Firstly, to investigate bonding temperature effects, the curing rate of the NCFs and strength of interconnection under different bonding temperatures (150 °C ∼ 230 °C) were evaluated using differential scanning calorimeter (DSC) test and a 90 degree peeling test, respectively. Then, the electrical performances of NCF joints bonded at different bonding temperatures were monitored by measuring daisy chain and insulated resistance. After that, the reliability tests of 85 °C / 85 % RH thermal humidity storage test (THST), and 55 °C ∼ 125 °C thermal cycling test (TCT) were performed. Finally, the cross-section images of failure samples from SEM were observed to find the failure mode.