Formation of Source/Drain extension by Antimony implantation for high performance DRAM peripheral transistors

J. Cha, S. Jin, Anbae Lee, Hun-Sung Lee, Dongseok Kim, Jihwan Park, Ilsik Jang, Ahyoung Oh, S. Jang, S. Yeom, Sung-ki Park, Cjay Cho, S. Hwang, Jongwon Park, Sungho Jo
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Abstract

We have investigated properties of Antimony implanted Si such as crystalline defect, dopant distribution, and sheet resistance before and after annealing using TEM, SIMS, and 4-point probe. The sheet resistance of Sb implanted Si shows 35% lower than Arsenic, even though junction depth is 25% shallower. Electrical behaviors of Sorce/Drain extension implanted with Sb show 10% improvement of Ion/Ioff characteristics without degradation of drain-induced barrier lowering compared to the As.
高性能DRAM外围晶体管中锑注入形成源极/漏极扩展
我们利用TEM, SIMS和4点探针研究了锑注入Si在退火前后的晶体缺陷,掺杂分布和片电阻等特性。Sb注入Si的片电阻比砷低35%,尽管结深浅25%。与As相比,注入Sb的源极/漏极扩展电极的离子/ off特性提高了10%,而漏极诱导的势垒降低没有退化。
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