Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF (Chip-in-Flex) Packages at Humid Environment

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) Pub Date : 2018-05-31 DOI:10.1109/ECTC.2018.00349

Ji-hye Kim, Tae-Ik Lee, Taek‐Soo Kim, K. Paik

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引用次数: 1

Abstract

In this paper, the effects of ACFs material properties on the dynamic bending reliability was investigated not only at room temperature but also at heated and humid conditions. There are two ACFs material properties improving the dynamic bending reliability of CIF packages. The first is the increase of resin modulus of ACFs, and the second is the increase of adhesion strength of ACFs. For experiments, 4 types of ACFs with different modulus and adhesion strengthes were prepared. Dynamic bending tests of ACFs-assembled CIF packages were performed up to 160,000 bending cycles with the bending radius of 6 mm at room temperature. In addition, the environmental reliability of ACFs-assembled CIF packages were also evaluated at the 85°C/85% RH thermal humidity storage test for 1,000 hours using a bending rod of 6 mm radius. As a result, it was found out that the most effective method to obtain higher bending reliability of CIF packages is increasing the modulus of ACFs not only at room temperature but also at thermal and humid conditions.

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湿润环境下ACFs模量和粘接强度对CIF (Chip-in-Flex)封装弯曲可靠性的影响

本文研究了ACFs材料性能对室温和湿热条件下动态弯曲可靠性的影响。ACFs材料的两种性能提高了CIF封装的动态弯曲可靠性。一是ACFs的树脂模量增加，二是ACFs的粘接强度增加。实验制备了4种不同模量和粘接强度的ACFs。在室温下，对acfs组装的CIF包装进行了16万次的动态弯曲试验，弯曲半径为6mm。此外，acfs组装的CIF包装的环境可靠性也在85°C/85% RH的热湿度存储测试中进行了评估，使用半径为6mm的弯曲棒进行了1000小时的测试。结果表明，提高CIF包件的弯曲可靠性的最有效方法是提高ACFs在室温和湿热条件下的模量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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