C. Zhan, P. Tzeng, J. Lau, M. Dai, H. Chien, Ching-Kuan Lee, Shang-Tsai Wu, K. Kao, Shin-Yi Huang, Chia-Wen Fan, Su-Ching Chung, Yu-wei Huang, Yu-Min Lin, Jing-Yao Chang, Tsung-Fu Yang, Tai-Hung Chen, R. Lo, M. Kao
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引用次数: 17
Abstract
In this study, a 3D IC integration system-in-package (SiP) with TSV/RDL/IPD interposer is designed and developed. Emphasis is placed on the Cu revealing, embedded stress sensors, non-destructive inspection, thermal modeling and measurement, and final assembly and reliability assessments.
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