High-performance 0.5 mu m CMOS technology for logic LSIs with embedded large capacity SRAMs

M. Norishima, H. Yoshinari, H. Hayashida, T. Eguchi, K. Kasai, H. Shinagawa, T. Matsunaga, T. Matsuno, H. Shibata, Y. Toyoshima, K. Hashimoto
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引用次数: 3

Abstract

The optimum device design of 0.5 mu m CMOS for logic LSIs with embedded large-capacity SRAMs (static RAMs) with a 3.3 V supply voltage is proposed. In order to attain high performance with a 3.3 V supply, the p-MOSFET structure was designed and the gate oxide thickness and junction capacitance were optimized. A poly-Si load SRAM cell with a triple-well structure on p-substrate, WSi-polycide gate electrode, and triple-level metallization with W plug via holes were implemented. By careful design of each parameter and proper integration of the technologies, a high-performance 0.5 mu m CMOS with large-capacity cache memories was realized.<>
高性能0.5 μ m CMOS技术,用于嵌入大容量sram的逻辑lsi
提出了一种用于嵌入式大容量ram(静态ram)、供电电压为3.3 V的逻辑lsi的0.5 μ m CMOS的最佳器件设计。为了在3.3 V电源下获得优异的性能,设计了p-MOSFET结构,并对栅极氧化物厚度和结电容进行了优化。实现了p衬底上三孔结构的多晶硅负载SRAM电池,采用wsi多晶硅栅极电极,并采用W插头过孔进行三能级金属化。通过对各个参数的精心设计和技术的合理集成,实现了具有大容量高速缓存存储器的高性能0.5 μ m CMOS。
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