Direct bonding of piezoelectric materials onto Si

ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics Pub Date : 1996-08-18 DOI:10.1109/ISAF.1996.598125

K. Eda, Y. Tomita, M. Sugimoto, T. Ogura, A. Nanba, Y. Taguchi, O. Kawasaki

引用次数: 3

Abstract

New composite semiconductor-piezoelectric materials fabricated by direct bonding technology are reported. The fabrication process, analysis of the bonded interface microstructures, and their applications are also reported.

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压电材料在硅上的直接键合

报道了采用直接键合技术制备的新型复合半导体压电材料。本文还报道了其制备工艺、结合界面微观结构分析及其应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics

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