Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding

Reinhard Schemmel, Florian Eacock, Collin Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro
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引用次数: 1

Abstract

Ultrasonic joining is a common industrial process. To build electrical connections in the electronics industry, uni-axial and torsional ultrasonic vibration have been used to join different types of workpieces for decades. Many influencing factors like ultrasonic power, bond normal force, bond duration and frequency are known to have a high impact on bond quality and reliability. Multi-dimensional bonding has been investigated in the past to increase ultrasonic power and consequently bond strength. This contribution is focused on the comparison of circular, multi-frequency planar and uniaxial vibration trajectories used for ultrasonic bonding of copper pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic microscopy and interface cross-sections.
多维振动轨迹对超声粘接质量和失效模式的影响
超声波连接是一种常见的工业工艺。为了在电子工业中建立电气连接,几十年来一直使用单轴和扭转超声振动来连接不同类型的工件。超声功率、键合法向力、键合时间和频率等因素对键合质量和可靠性有很大影响。为了提高超声功率和结合强度,过去已经研究了多维键合。这一贡献集中在圆形、多频平面和单轴振动轨迹的比较,用于超声键合铜衬底上的铜引脚。通过剪切试验、扫描声显微镜和界面截面分析了粘结质量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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