C. S. Lin, W.T. Huang, A. Huang, Y.H. Yang, Y. Hsu, S.K. Yang, Jack Liu, H.W. Tseng, Jarcle Huang, B.Y. Chou, Kevin Huang, W. Chang, Daniel Chang, C. H. Chien, H. Yeh, P. Liu, C.D. Hsieh, H. Chuang, A. Kalnitsky
{"title":"An approach to embedding traditional non-volatile memories into a deep sub-micron CMOS","authors":"C. S. Lin, W.T. Huang, A. Huang, Y.H. Yang, Y. Hsu, S.K. Yang, Jack Liu, H.W. Tseng, Jarcle Huang, B.Y. Chou, Kevin Huang, W. Chang, Daniel Chang, C. H. Chien, H. Yeh, P. Liu, C.D. Hsieh, H. Chuang, A. Kalnitsky","doi":"10.1109/VLSITechnology18217.2020.9265049","DOIUrl":null,"url":null,"abstract":"This work presents an example of 16nm FinFET CMOS with an embedded flash 40nm memory employing Wafer-on-Wafer (WoW) technology. Our results show comparable embedded flash performance, CMOS logic speed and power consumption comparing corresponding circuits before and after the 3D assembly. WoW integration can provide embedded flash solution for advanced CMOS nodes where no solutions currently exist. The method is also applicable for embedding other functionalities into the advanced CMOS.","PeriodicalId":6850,"journal":{"name":"2020 IEEE Symposium on VLSI Technology","volume":"106 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSITechnology18217.2020.9265049","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This work presents an example of 16nm FinFET CMOS with an embedded flash 40nm memory employing Wafer-on-Wafer (WoW) technology. Our results show comparable embedded flash performance, CMOS logic speed and power consumption comparing corresponding circuits before and after the 3D assembly. WoW integration can provide embedded flash solution for advanced CMOS nodes where no solutions currently exist. The method is also applicable for embedding other functionalities into the advanced CMOS.