Fabrication of Si/SiO2/Au nanoparticles/HfO2 MOS capacitor structure by spin coating method

Shih-Tang Chen, Hua-Chiang Chen, Kun-Cheng Huang, Fu-Ken Liu, C. Leu
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Abstract

In this work, a Metal-Oxide-Semiconductor (MOS) capacitor (Si/SiO2/Au nanoparticles/HfO2) has been fabricated. Gold (Au) nanoparticles with particle size of about 3.3nm were synthesized by chemical reduction method. Then the self-assembled gold nanoparticles were attached to 3-aminopropyltrimethoxysilane (APTMS) modified silicon oxide substrates by the spin coating method. With the spin coating method, the gold nanoparticles can be fabricated onto 5.0 nm thermally grown silicon oxide with highly packing density of 1×1012cm−2 in a short processing time. Finally, the sol-gel derived HfO2 layer was spin coated to construct a Si/SiO2/Au nanoparticles/HfO2 structure. The MOS structure embedded with Au nanoparticles showed well defined counterclockwise C-V hysteresis curves which indicating a good memory effect. The flat-band voltage shift was about 2.7 V at a swapping voltage between ±5V. Furthermore, the MOS structure embedded with Au nanoparticles behaved a desirable retention characteristic up to 104s. We have succeeded to fabricate the Metal-Oxide-Semiconductor capacitor structure (Si/SiO2/Au nanoparticles/HfO2) by a spin coating method. The spin coating method has many advantages like short fabrication time, high uniformity, and better reproducibility when compared with the traditional immersion method. Therefore, the spin coating method has the potential to be applied to nanofabrication processes in mass production.
自旋镀膜法制备Si/SiO2/Au纳米颗粒/HfO2 MOS电容器结构
本文制备了一种金属氧化物半导体(MOS)电容器(Si/SiO2/Au纳米颗粒/HfO2)。采用化学还原法制备了粒径约3.3nm的金(Au)纳米颗粒。然后用自旋涂覆法将自组装金纳米粒子附着在3-氨基丙基三甲氧基硅烷(APTMS)修饰的氧化硅衬底上。利用自旋包覆方法,可以在短时间内将金纳米颗粒制备在5.0 nm的热生长氧化硅上,其堆积密度为1×1012cm−2。最后,自旋涂覆溶胶-凝胶衍生的HfO2层,构建Si/SiO2/Au纳米颗粒/HfO2结构。嵌入金纳米粒子的MOS结构呈现出清晰的逆时针C-V迟滞曲线,表明其具有良好的记忆效应。在±5V切换电压时,平带电压位移约为2.7 V。此外,嵌入金纳米粒子的MOS结构具有良好的保留特性,保留率高达104s。我们成功地用自旋镀膜方法制备了金属氧化物半导体电容器结构(Si/SiO2/Au纳米颗粒/HfO2)。与传统浸渍法相比,该方法具有制备时间短、均匀性高、重现性好等优点。因此,自旋涂层方法具有应用于大规模生产的纳米加工工艺的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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