T. Yu, Shih-Yu Sun, Chih-Liang Ding, Pai-Chi Li, A. Wu
{"title":"Reconfigurable Color Doppler DSP Engine for High-Frequency Ultrasonic Imaging Systems","authors":"T. Yu, Shih-Yu Sun, Chih-Liang Ding, Pai-Chi Li, A. Wu","doi":"10.1109/SIPS.2007.4387542","DOIUrl":null,"url":null,"abstract":"A single-chip reconfigurable Color Doppler DSP engine is presented. It acts as the computation kernel of the high-frequency ultrasonic imaging system under development. The flexibility of the proposed DSP engine enables users to acquire sufficient information as needed, while the specificity of the hardware compared to general-purpose processors reduces cost and power consumption. This chip is implemented by TSMC 0.18 ¿m 1P6M CMOS technology. The die size is 2.94*2.94 mm2, and the power consumption is 184 mW when frame rate = 50, frame size = 512*256, and packet size = 8.","PeriodicalId":93225,"journal":{"name":"Proceedings. IEEE Workshop on Signal Processing Systems (2007-2014)","volume":"109 1","pages":"187-192"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. IEEE Workshop on Signal Processing Systems (2007-2014)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIPS.2007.4387542","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
A single-chip reconfigurable Color Doppler DSP engine is presented. It acts as the computation kernel of the high-frequency ultrasonic imaging system under development. The flexibility of the proposed DSP engine enables users to acquire sufficient information as needed, while the specificity of the hardware compared to general-purpose processors reduces cost and power consumption. This chip is implemented by TSMC 0.18 ¿m 1P6M CMOS technology. The die size is 2.94*2.94 mm2, and the power consumption is 184 mW when frame rate = 50, frame size = 512*256, and packet size = 8.