PADRE: Physically-Aware Diagnostic Resolution Enhancement

Yang Xue, O. Poku, Xin Li, Shawn Blanton
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引用次数: 30

Abstract

Diagnosis is the first step of IC failure analysis. The conventional objective of identifying the failure locations has been augmented with various physically-aware techniques that are intended to improve both diagnostic resolution and accuracy. Despite these advances, it is often the case however that resolution, i.e., the number of locations or candidates reported by diagnosis, exceeds the number of actual failing locations. Imperfect resolution greatly hinders any follow-on, information-extraction analyses (e.g., physical failure analysis, volume diagnosis, etc.) due to the resulting ambiguity. To address this major challenge, a novel, unsupervised learning methodology that uses ordinarily-available tester and simulation data is described that significantly improves resolution with virtually no negative impact on accuracy. Simulation experiments using a variety of fault types (SSL, MSL, bridges, opens and cell-level input-pattern faults) reveal that the number of failed ICs that have perfect resolution can be more than doubled, and overall resolution is improved by 22%. Application to silicon data also demonstrates significant improvement in resolution (38% overall and the number of chips with ideal resolution is nearly tripled) and verification using PFA demonstrates that accuracy is maintained.
物理感知诊断分辨率增强
诊断是集成电路故障分析的第一步。识别故障位置的传统目标已经被各种物理感知技术所增强,这些技术旨在提高诊断分辨率和准确性。尽管取得了这些进展,但通常情况下,诊断结果(即诊断报告的位置或候选位置的数量)超过了实际失败位置的数量。由于产生的模糊性,不完美的分辨率极大地阻碍了任何后续的信息提取分析(例如,物理故障分析,体积诊断等)。为了解决这一主要挑战,本文描述了一种新的无监督学习方法,该方法使用通常可用的测试器和模拟数据,可以显着提高分辨率,同时几乎不会对准确性产生负面影响。使用各种故障类型(SSL、MSL、桥接、打开和单元级输入模式故障)的仿真实验表明,具有完美分辨率的故障ic的数量可以增加一倍以上,总体分辨率提高22%。对硅数据的应用也显示出分辨率的显着提高(总体38%,具有理想分辨率的芯片数量几乎增加了三倍),使用PFA验证表明保持了准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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