Real-time Reliability Testing Advancements on Production Electronic Hardware

M. Bixenman, Mark McMeen
{"title":"Real-time Reliability Testing Advancements on Production Electronic Hardware","authors":"M. Bixenman, Mark McMeen","doi":"10.23919/PANPACIFIC.2019.8696621","DOIUrl":null,"url":null,"abstract":"OEMs (Original Equipment Manufacturers) and EMSs (Electronic Manufacturing Services) work to a set of guidelines and test procedures for qualification of hardware when changing soldering materials, process conditions, cleaning materials, cleaning machines, and conformal coating. Evaluation and use of any soldering material, reflow setting, or cleaning material, the EMS shall confirm that the proposed materials are characterized and qualified to the applicable ANSI/IPC Industry Standards. Additionally, IPCJ-STD-001G, Amendment 1 issued changes to Cleanliness Standards requiring the assembler to develop objective evidence that a specific cleanliness condition renders a reliable device.For many PCB designs with complex component geometries, cleanliness can impact reliability and circuit performance. The gold standard for circuit qualification has been to pass SIR (Surface Insulation Resistance) testing with resistivity values that show that the design and process do not interfere with the circuit performance. Up until now, SIR testing hasn’t been practical on the manufacturing floor as the test traditionally takes seven days to complete, and requires equipment that is complicated to use. The purpose of this research is to design instrumentation and test methods that allow both the OEM and EMS to perform process development and process control using electrical test methods for use in an operations environment.The research study centers on “On-going Reliability Testing” that allows the assembler to take testing to the technician level. Using a combination of modern, configurable test cards that scrutinize high-risk circuits and devices integrated on the assembly, the EMS can correlate cleanliness to production hardware. This bottom-up testing methodology allows the assembler to repeat IPC testing in their factory – objective evidence to J-STD-001G, Amendment 1. Also, they can expand testing to other areas such as system design, process development, process control, and quality assurance.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"245 Pt 1 1","pages":"1-13"},"PeriodicalIF":0.0000,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/PANPACIFIC.2019.8696621","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

OEMs (Original Equipment Manufacturers) and EMSs (Electronic Manufacturing Services) work to a set of guidelines and test procedures for qualification of hardware when changing soldering materials, process conditions, cleaning materials, cleaning machines, and conformal coating. Evaluation and use of any soldering material, reflow setting, or cleaning material, the EMS shall confirm that the proposed materials are characterized and qualified to the applicable ANSI/IPC Industry Standards. Additionally, IPCJ-STD-001G, Amendment 1 issued changes to Cleanliness Standards requiring the assembler to develop objective evidence that a specific cleanliness condition renders a reliable device.For many PCB designs with complex component geometries, cleanliness can impact reliability and circuit performance. The gold standard for circuit qualification has been to pass SIR (Surface Insulation Resistance) testing with resistivity values that show that the design and process do not interfere with the circuit performance. Up until now, SIR testing hasn’t been practical on the manufacturing floor as the test traditionally takes seven days to complete, and requires equipment that is complicated to use. The purpose of this research is to design instrumentation and test methods that allow both the OEM and EMS to perform process development and process control using electrical test methods for use in an operations environment.The research study centers on “On-going Reliability Testing” that allows the assembler to take testing to the technician level. Using a combination of modern, configurable test cards that scrutinize high-risk circuits and devices integrated on the assembly, the EMS can correlate cleanliness to production hardware. This bottom-up testing methodology allows the assembler to repeat IPC testing in their factory – objective evidence to J-STD-001G, Amendment 1. Also, they can expand testing to other areas such as system design, process development, process control, and quality assurance.
生产电子硬件的实时可靠性测试进展
oem(原始设备制造商)和ems(电子制造服务)在改变焊接材料、工艺条件、清洁材料、清洁机器和保形涂层时,遵循一套指导方针和测试程序来对硬件进行鉴定。评估和使用任何焊接材料、回流设置或清洁材料时,EMS应确认所建议的材料符合适用的ANSI/IPC工业标准。此外,IPCJ-STD-001G修正案1发布了对清洁度标准的更改,要求装配者提供客观证据,证明特定清洁度条件可以使设备可靠。对于许多具有复杂元件几何形状的PCB设计,清洁度会影响可靠性和电路性能。电路合格的金标准是通过SIR(表面绝缘电阻)测试,其电阻率值表明设计和工艺不会干扰电路性能。到目前为止,SIR测试还没有在生产车间实际应用,因为测试通常需要7天才能完成,并且需要使用复杂的设备。本研究的目的是设计仪器和测试方法,使OEM和EMS都能在操作环境中使用电气测试方法进行过程开发和过程控制。研究的中心是“持续可靠性测试”,它允许装配者将测试提升到技术水平。使用现代的、可配置的测试卡,仔细检查集成在组装上的高风险电路和设备,EMS可以将清洁度与生产硬件联系起来。这种自下而上的测试方法允许装配者在他们的工厂重复IPC测试- J-STD-001G修正案1的客观证据。此外,他们可以将测试扩展到其他领域,如系统设计、过程开发、过程控制和质量保证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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