Analytical Study of Shear-Thinning Fluid Flow in Direct Ink Writing Process

IF 1 Q4 ENGINEERING, MANUFACTURING
Zipeng Guo, F. Fei, Xuan Song, Chi Zhou
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引用次数: 1

Abstract

As a facile and versatile additive manufacturing technology, direct ink writing (DIW) has attracted considerable interest in academia and industry to fabricate three-dimensional structures with unique properties and functionalities. However, so far, the physical phenomena during the DIW process are not revealed in detail, leaving a research gap between the physical experiments and the underlying theories. Here, we presented a comprehensive simulation study of non-Newtonian ink flow during the DIW process. We used the computational fluid dynamics (CFD) method and revealed the shear-thinning behavior during the extrusion process. Different nozzle geometry models were adopted in the simulation. The advantages and drawbacks of each syringe-nozzle geometry were analyzed. In addition, the ink shear stress and velocity fields were investigated and compared in the case studies. Based on these investigations and analysis, we proposed an improved syringe-nozzle geometry towards high-resolution DIW. Consequently, the high-resolution and high shape fidelity DIW could enhance the DIW product performance. The results developed in this work offer valuable guidelines and could accelerate further advancement of DIW.
直墨书写过程中剪切-稀释流体流动的分析研究
作为一种简单、通用的增材制造技术,直接墨水书写(DIW)在制造具有独特性能和功能的三维结构方面引起了学术界和工业界的极大兴趣。然而,到目前为止,DIW过程中的物理现象还没有被详细揭示,物理实验与基础理论之间存在研究差距。在这里,我们提出了一个全面的模拟研究非牛顿墨水流动在DIW过程中。采用计算流体力学(CFD)方法,揭示了挤压过程中的剪切减薄行为。仿真中采用了不同的喷嘴几何模型。分析了各种注射器-喷嘴几何形状的优缺点。此外,还对油墨的剪切应力场和速度场进行了对比研究。基于这些研究和分析,我们提出了一种改进的注射器-喷嘴几何形状,以实现高分辨率的DIW。因此,高分辨率和高保真度的DIW可以提高DIW产品的性能。本工作的结果提供了有价值的指导,可以加速DIW的进一步发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Micro and Nano-Manufacturing
Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-
CiteScore
2.70
自引率
0.00%
发文量
12
期刊介绍: The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.
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