Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects

Joseph M. de Saxcé, Philippe Roux-Lévy, Chun Fei Siah, Jianxiong Wang, B. Tay, P. Coquet, D. Baillargeat
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Abstract

In this work, we investigate the performances of vertically aligned carbon nanotube (VACNT) arrays for high frequency interconnects. The frequency range of this study is the W band (75 GHz to 110 GHz). The type of interconnect is coplanar, meaning the interconnect can connect two subparts supporting a coplanar waveguide (CPW) mode. Starting from the promising results of a previously measured device [1] we suggest a way to improve the behavior of VACNT arrays interconnects. We perform full-wave modeling of a new structure that will be fabricated and tested and we compare different modelling approaches for the design of such interconnects.
基于毫米波碳纳米管的倒装芯片共面互连
在这项工作中,我们研究了垂直排列碳纳米管(VACNT)阵列在高频互连中的性能。本研究的频率范围为W频段(75 GHz至110 GHz)。互连的类型是共面的,这意味着互连可以连接两个支持共面波导(CPW)模式的子部件。从先前测量设备的有希望的结果开始[1],我们提出了一种改善VACNT阵列互连行为的方法。我们对即将制造和测试的新结构进行全波建模,并比较了设计这种互连的不同建模方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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