TCAD software for ESD on-chip protection design

Wolfgang Fichtner, K. Esmark, Wolfgang Stadler
{"title":"TCAD software for ESD on-chip protection design","authors":"Wolfgang Fichtner, K. Esmark, Wolfgang Stadler","doi":"10.1109/IEDM.2001.979493","DOIUrl":null,"url":null,"abstract":"Electrostatic discharges (ESD) have always been a serious problem in the semiconductor industry. The presence of high electric fields and the amount of energy dissipated by the semiconductor devices during an ESD can give rise to electric breakdown of sensitive isolation layers as well as local melting, which leads to a latent damage or even breakdown of the whole integrated circuit (IC). One measure to prevent the breakdown of the IC is to provide the product with an adequate ESD robustness by implementing a kind of lightning conductor in the form of a protection element on the product itself. This methodology is called on-chip ESD protection.","PeriodicalId":13825,"journal":{"name":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","volume":"19 1","pages":"14.1.1-14.1.4"},"PeriodicalIF":0.0000,"publicationDate":"2001-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2001.979493","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 17

Abstract

Electrostatic discharges (ESD) have always been a serious problem in the semiconductor industry. The presence of high electric fields and the amount of energy dissipated by the semiconductor devices during an ESD can give rise to electric breakdown of sensitive isolation layers as well as local melting, which leads to a latent damage or even breakdown of the whole integrated circuit (IC). One measure to prevent the breakdown of the IC is to provide the product with an adequate ESD robustness by implementing a kind of lightning conductor in the form of a protection element on the product itself. This methodology is called on-chip ESD protection.
TCAD软件用于ESD片上保护设计
静电放电(ESD)一直是半导体工业中的一个严重问题。在ESD过程中,高电场的存在和半导体器件耗散的能量会导致敏感隔离层的电击穿以及局部熔化,从而导致整个集成电路(IC)的潜在损坏甚至击穿。防止IC击穿的一种措施是通过在产品本身上实施一种以保护元件形式的避雷导体,为产品提供足够的ESD稳健性。这种方法被称为片上ESD保护。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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