Study of plasma etching impact on chemoepitaxy directed self-assembly

M. G. Gusmão Cacho, K. Benotmane, A. Le Pennec, C. Bouet, P. Pimenta-Barros, G. Rademaker, M. Argoud, R. Tiron, N. Possémé
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引用次数: 1

Abstract

Directed self-assembly (DSA) of block copolymers is one of the most promising solutions investigated to obtain small and dense patterns for the sub-10 nm nodes. One of the most important aspects of the DSA technology is the orientation control of the block copolymer, which is determined by surface properties and different guiding techniques. Regarding the Arkema-CEA (ACE) chemoepitaxy process, one of the critical parameters is the preservation of the neutral layer’s properties during hydrofluoric acid wet etching, especially regarding its adherence to the titanium nitride (TiN) hard mask. In this paper, the different etching steps involved in the ACE integration flow are evaluated. Their effects on the surface properties of the TiN hard mask and on the adherence of the neutral layer are investigated by x-ray photoelectron spectroscopy and contact angle measurements. Finally, the results obtained are used to optimize the different etching steps, thus demonstrating the chemoepitaxy of a polystyrene-b-poly(methyl methacrylate) block copolymer with 32 nm pitch without alignment defects on a 100 μm2 surface.
等离子体刻蚀对化学外延定向自组装影响的研究
嵌段共聚物的定向自组装(DSA)是一种最有前途的解决方案,可以在10 nm以下的节点上获得小而致密的图案。DSA技术最重要的一个方面是嵌段共聚物的取向控制,这是由表面性质和不同的导向技术决定的。对于Arkema-CEA (ACE)化学外延工艺,关键参数之一是在氢氟酸湿法蚀刻过程中保持中性层的性质,特别是其与氮化钛(TiN)硬掩膜的粘附性。本文对ACE集成流程中涉及的不同蚀刻步骤进行了评估。通过x射线光电子能谱和接触角测量研究了它们对TiN硬掩膜表面性能和中性层粘附性的影响。最后,将所得结果用于优化不同的蚀刻步骤,从而证明了32 nm节距的聚苯乙烯-b-聚甲基丙烯酸甲酯嵌段共聚物在100 μm2表面上无对准缺陷的化学外延。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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