COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING

Jonas Strobelt, J. Bauer, M. Dreissigacker, O. Hoelck, T. Braun, K. Becker, M. Schneider-Ramelow, K. Lang
{"title":"COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING","authors":"Jonas Strobelt, J. Bauer, M. Dreissigacker, O. Hoelck, T. Braun, K. Becker, M. Schneider-Ramelow, K. Lang","doi":"10.4071/2380-4505-2019.1.000568","DOIUrl":null,"url":null,"abstract":"\n In microelectronic packaging, encapsulation by compression and transfer molding is a crucial process block to ensure device reliability. Material properties of encapsulants, highly filled systems of reactive epoxy molding compounds (EMC), strongly depend on process conditions in a complex manner and vary over time. Shear-thinning behavior, as well as time- and temperature-dependent conversion strongly impact the viscosity of the polymer melt. In all fields of application, such as automotive or IoT, demands towards miniaturization, lifetime and environmental conditions increase. Thus, detailed understanding of the complex material behavior is of vital importance.\n Typically, shear-thinning behavior of polymer melts is characterized using a conventional rheometer in oscillation mode under varying shear-rates and temperatures. Limitations of this approach are, that measurements at process temperature typically cannot be performed due to the high reactivity of the encapsulant at these temperatures (e.g. 175 °C for transfer molding). Therefore extrapolation to the correct temperature range is required. Furthermore, measurements in oscillation mode cannot necessarily be transferred to real process conditions, where a continuous flow is present.\n To overcome these limitations the inline viscometer can be used, a specially designed measurement tool for a transfer molding machine developed by Fico/Besi. The polymer melt is pressed through a narrow slit under known volumetric flow at process temperature. By measuring the pressure difference before and after the slit, the viscosity can be calculated.\n In order to better understand and also predict material behavior, inline viscosimetry is combined with rheometer measurements. This allows to maintain the advantages of conventional rheometry regarding material consumption and large shear-rate measuring range. At the same time, the inline approach provides relevant data under process conditions. The synthesis of both approaches yields a correction of the rheometer measurements, ultimately improving viscosity modeling and being an improved basis for process simulation.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"2 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/2380-4505-2019.1.000568","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

In microelectronic packaging, encapsulation by compression and transfer molding is a crucial process block to ensure device reliability. Material properties of encapsulants, highly filled systems of reactive epoxy molding compounds (EMC), strongly depend on process conditions in a complex manner and vary over time. Shear-thinning behavior, as well as time- and temperature-dependent conversion strongly impact the viscosity of the polymer melt. In all fields of application, such as automotive or IoT, demands towards miniaturization, lifetime and environmental conditions increase. Thus, detailed understanding of the complex material behavior is of vital importance. Typically, shear-thinning behavior of polymer melts is characterized using a conventional rheometer in oscillation mode under varying shear-rates and temperatures. Limitations of this approach are, that measurements at process temperature typically cannot be performed due to the high reactivity of the encapsulant at these temperatures (e.g. 175 °C for transfer molding). Therefore extrapolation to the correct temperature range is required. Furthermore, measurements in oscillation mode cannot necessarily be transferred to real process conditions, where a continuous flow is present. To overcome these limitations the inline viscometer can be used, a specially designed measurement tool for a transfer molding machine developed by Fico/Besi. The polymer melt is pressed through a narrow slit under known volumetric flow at process temperature. By measuring the pressure difference before and after the slit, the viscosity can be calculated. In order to better understand and also predict material behavior, inline viscosimetry is combined with rheometer measurements. This allows to maintain the advantages of conventional rheometry regarding material consumption and large shear-rate measuring range. At the same time, the inline approach provides relevant data under process conditions. The synthesis of both approaches yields a correction of the rheometer measurements, ultimately improving viscosity modeling and being an improved basis for process simulation.
结合流变学和在线粘度法的优点,改进粘度建模
在微电子封装中,通过压缩和传递成型封装是确保器件可靠性的关键工艺模块。封装剂是一种高度填充的反应性环氧成型化合物(EMC)体系,其材料性能在很大程度上取决于复杂的工艺条件,并随着时间的推移而变化。剪切减薄行为,以及依赖于时间和温度的转化强烈影响聚合物熔体的粘度。在汽车或物联网等所有应用领域,对小型化、寿命和环境条件的需求都在增加。因此,详细了解复杂材料的行为是至关重要的。通常,聚合物熔体的剪切变薄行为是用传统的流变仪在振荡模式下在不同的剪切速率和温度下进行表征的。这种方法的局限性是,由于封装剂在这些温度下的高反应性,通常无法在工艺温度下进行测量(例如,传递成型时为175°C)。因此,需要外推到正确的温度范围。此外,振荡模式下的测量不一定能转移到实际的工艺条件下,在那里存在连续的流动。为了克服这些限制,可以使用内联粘度计,这是一种由Fico/Besi开发的专门设计的传递成型机测量工具。在已知的体积流量和工艺温度下,将聚合物熔体压过窄缝。通过测量狭缝前后的压差,可以计算出粘度。为了更好地理解和预测材料的行为,在线粘度测量与流变仪测量相结合。这可以保持传统流变法在材料消耗和大剪切率测量范围方面的优势。同时,内联方法提供了工艺条件下的相关数据。两种方法的综合产生了对流变仪测量的修正,最终改善了粘度建模,并成为过程模拟的改进基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信