Pinhole-free Pyrex glass etching using HF-H/sub 2/SO/sub 4/ mixed acid and its applications for a PDMS microflow system

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. Pub Date : 2005-06-05 DOI:10.1109/SENSOR.2005.1497365

T. Arakawa, Y. Sato, T. Ueno, T. Funatsu, S. Shoji

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引用次数: 4

Abstract

Useful Pyrex glass etching method using HF and H/sub 2/SO/sub 4/ mixed acid was studied. To realize the etching behaviors of constant etch rate, high masks durability, small under cut and pinhole free, optimum composition of HF-H/sub 2/SO/sub 4/ system was found out. Pinhole-free etching, constant etching rate of 0.5 /spl mu/m/min and smooth surface of less than 4.6 nm was obtained at 0.8vol% HF and 32vol% H/sub 2/SO/sub 4/. This system realized high durability of the etching mask of Si, Cr/Au and even photoresists. This method is useful not only to fabricate Pyrex glass microchannels but also to make PDMS molds. We fabricated a prototype of the pneumatic actuated microvalve system for the single molecular imaging under total internal reflection fluorescence microscopy (TIRFM). The leakage free valve actions are confirmed and the switching time of open-close and close-open modes are 100 msec and 120 msec respectively.

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利用HF-H/sub - 2/SO/sub - 4/混合酸蚀刻无针孔耐热玻璃及其在PDMS微流系统中的应用

研究了用HF和H/ sub2 /SO/ sub4 /混合酸刻蚀耐热玻璃的方法。为了实现恒刻蚀速率、高掩模耐久性、小下切和无针孔的刻蚀性能，找出了HF-H/sub 2/SO/sub 4/体系的最佳组成。在0.8vol% HF和32vol% H/sub 2/SO/sub 4/条件下，获得了无针孔刻蚀，刻蚀速率为0.5 /spl mu/m/min，表面光滑小于4.6 nm。该系统实现了Si、Cr/Au甚至光刻胶的高耐久性。该方法不仅适用于热玻璃微通道的制作，也适用于PDMS模具的制作。我们制作了一个用于全内反射荧光显微镜(TIRFM)单分子成像的气动微阀系统原型。确认无泄漏阀门动作，启闭和关开模式切换时间分别为100 msec和120 msec。

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来源期刊

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.

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