Antimony assisted arsenic S/D extension (A/sup 3/ SDE) engineering for sub-0.1 /spl mu/m nMOSFETs : a novel approach to steep and retrograde indium pocket profiles

H. Wang, C.C. Wang, C. Hsieh, S. Lu, M. Chiang, Y. Chu, C. Chen, T. Ong, Tahui Wang, P. Griffin, C. H. Diaz
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引用次数: 2

Abstract

We propose a novel process whereby Antimony Assisted Arsenic Source/Drain Extension (A/sup 3/ SDE) is employed to realize a steep and retrograde indium pocket profile for sub-0.1 /spl mu/m nMOSFETs. By engineering the defect distributions in the amorphous layer created by an indium implant, this new process improves by 8% the current drive while maintaining the same I/sub off/. It reduces nMOS diode leakage by two orders of magnitude and sidewall junction capacitance near the gate by 14%. Reliability assessment of devices fabricated by the A/sup 3/ SDE process reveals significant improvement in hot carrier effects and no observable degradation of gate oxide integrity.
用于低于0.1 /spl mu/m的nmosfet的锑辅助砷S/D扩展(A/sup 3/ SDE)工程:一种陡峭和逆行铟口袋轮廓的新方法
我们提出了一种新的工艺,即采用锑辅助砷源/漏极扩展(a /sup 3/ SDE)来实现低于0.1 /spl mu/m的nmosfet的陡峭和逆行铟口袋轮廓。通过设计由铟植入物产生的非晶层中的缺陷分布,该新工艺在保持相同的I/sub off/的情况下,将电流驱动提高了8%。它使nMOS二极管泄漏减少了两个数量级,栅极附近的侧壁结电容减少了14%。对A/sup 3/ SDE工艺制备的器件的可靠性评估表明,热载子效应得到了显著改善,栅极氧化物完整性没有明显下降。
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