Subtractive W contact and local interconnect co-integration (CLIC)

Abstract

The resistivity of W interconnects deposited by physical vapor deposition (PVD) and chemical vapor deposition (CVD) is studied. The impacts of the deposition process and liner film stacks are explored. The results show acceptable resistivity for local interconnect (LI) applications with a linewidth down to 20nm and a wiring pitch down to 60nm. An integration scheme for combining a CVD W contact and local interconnect is explored as a means of providing a compact wiring solution with minimal impact on process complexity. The wiring concept is validated by integrating the local interconnects with trigate transistors.