A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications

HongWen Zhang, Samuel Lytwynec, Huaguang Wang, J. Geng, Francis Mutuku, N. Lee
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Abstract

Development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment in power device applications is driven by (1) the harmful effects of lead to human health and the environment, and (2) the demand of the improved bonding materials serving under high-power density and high-junction temperatures, especially for wide-band-gap power devices. A novel design, based on a mixed solder powder paste technology—Durafuse™—has been developed to deliver a Sn-rich HTLF paste, presenting the merits of both constituent powders. The combination of the rigid, high-melting SnSbCuAgX and the ductile, low-temperature Sn-rich solder in one paste enables reflow at a relatively low temperature (barely above the liquidus temperature of the final joint composition) and maintains the joint strength above 15MPa in the temperature range between 270°C and 295°C. The sufficient high-temperature strength has demonstrated the capability of maintaining the joint integrity during subsequent multiple SMT reflows below the 270°C peak temperature, regardless of the existence of a partial melting phase. Both X-ray inspection and cross-section microstructure have not shown any damage in the Si die or any noticeable cracks in the bonding joint, even after 3000 cycles of TCT (−40 to 150°C). In summary, Durafuse™ HT, the novel design of the high-temperature lead-free pastes, has shown the feasibility as a drop-in solution to replace high-lead solders for die-attachment in power discrete applications.
一种用于电源分立应用的高温无铅焊料的新设计
开发高温无铅焊料取代高铅焊料用于功率器件的模具连接,主要是由于:(1)铅对人体健康和环境的有害影响,以及(2)改进的键合材料在高功率密度和高结温下的需求,特别是用于宽带隙功率器件。一种基于混合锡粉膏技术durafuse™的新设计已经开发出来,可以提供富含锡的HTLF膏体,同时呈现两种成分粉末的优点。刚性、高熔点的SnSbCuAgX和延展性、低温富锡焊料结合在一个膏体中,可以在相对较低的温度(略高于最终接头成分的液相温度)下回流,并在270°C至295°C的温度范围内保持接头强度在15MPa以上。足够的高温强度证明了在270℃峰值温度以下的后续多次SMT回流中保持接头完整性的能力,无论是否存在部分熔化阶段。x射线检查和横截面显微结构均未显示Si模的任何损伤或接合处的任何明显裂纹,即使经过3000次TCT循环(- 40至150°C)。总之,Durafuse™HT是一种新颖的高温无铅浆料设计,作为一种可替代高铅焊料的解决方案,可用于电源分立应用的模具连接。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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