3D-Opto-MID for Asymmetric Optical Bus Couplers

L. Lorenz, Florian Hanesch, K. Nieweglowski, Y. Eiche, J. Franke, G. Hoffmann, L. Overmeyer, K. Bock
{"title":"3D-Opto-MID for Asymmetric Optical Bus Couplers","authors":"L. Lorenz, Florian Hanesch, K. Nieweglowski, Y. Eiche, J. Franke, G. Hoffmann, L. Overmeyer, K. Bock","doi":"10.1109/ESTC48849.2020.9229840","DOIUrl":null,"url":null,"abstract":"The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"143 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC48849.2020.9229840","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.
非对称光总线耦合器的3D-Opto-MID
开发易于使用且不需要波导中断的光总线系统是在中短距离网络中建立光互连的重要一步。从封装方面来看,挑战在于将光学部件和波导三维集成到一种称为3D-Opto-MID的新型封装中。在本文中,我们提出了一种在陶瓷厚膜衬底上进行立体光刻印刷的三维聚合物结构方法。因此,我们能够将3D打印的设计自由度与厚膜技术的出色射频和热管理特性相结合,这对光电转换器尤其重要。在三维结构上,波导用于母线耦合器,陶瓷用于电光转换器。此外,3D打印允许易于制造的对准和固定结构,具有高精度的耦合器。结果部分显示了对打印聚合物在陶瓷上的粘附行为的分析,以及与打印对准结构的可获得公差。测量的平均准直精度为31.1 μ m,对于使用的200 μ m多模波导来说,这是足够的。此外,我们展示了模块组件的光路功能,以及与总线波导的耦合,这证明了3D-Opto-MID集成的成功。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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