Broadband characterization of dielectric films for power-ground decoupling

J. Obrzut, R. Nozaki
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引用次数: 8

Abstract

We evaluated the dielectric permittivity and impedance characteristics of high dielectric constant polymer composite films. Such materials are being investigated by the electronic industry in response to the growing need for efficient integrated power-ground decoupling capacitance in microwave circuits and fast switching devices. In order to extend the dielectric measurements to the microwave range, we developed an appropriate expression for the input admittance of a thin film capacitance terminating a coaxial line. The theoretical model treats the capacitance as a distributed network and takes into consideration the wave propagation in the specimen section. The dielectric permittivity of several high dielectric constant materials for decoupling capacitance applications was evaluated at frequencies of 100 MHz to 10 GHz, and the corresponding impedance characteristics were determined directly in time domain. Polymer resins filled with ferroelectric ceramics showed low impedance values and flat impedance characteristics over a broad frequency range, which makes these materials attractive for power-ground decoupling applications in high-speed electronic circuits.
电源-地去耦介质薄膜的宽带特性
研究了高介电常数聚合物复合薄膜的介电常数和阻抗特性。电子工业正在研究这种材料,以响应微波电路和快速开关器件中对高效集成电源-地去耦电容日益增长的需求。为了将介电测量扩展到微波范围,我们建立了一个合适的薄膜电容输入导纳的表达式。理论模型将电容视为一个分布式网络,并考虑了波在试样截面中的传播。在100mhz ~ 10ghz频率范围内,对几种高介电常数材料的介电常数进行了解耦电容性能的评估,并在时域上直接确定了相应的阻抗特性。填充铁电陶瓷的聚合物树脂在宽频率范围内具有低阻抗值和平坦阻抗特性,这使得这些材料在高速电子电路中的电源-地去耦应用具有吸引力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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