Novel lithography technology for enhancing resolution limit at advanced packaging manufacturing

H. Matsui
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Abstract

New lithography method will be proposed in the paper to enhance resolution limit by half of current one while keeping depth of focus at the same value. The method is based on lithography and copper plating process in order to be applicable to advanced packaging manufacturing.
新型光刻技术提高先进包装制造的分辨率极限
本文将提出一种新的光刻方法,在保持焦深不变的情况下,将分辨率限制提高到现有方法的一半。该方法是基于光刻和镀铜工艺,以适用于先进的包装制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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