Intermetallic Compounds For Interconnect Metal Beyond 3 nm Node

Abstract

We report the recent results of NiAl and CuAl2 intermetallic compounds for advanced-node interconnect materials in place of Cu. Reported results of Co and Ru are briefly reviewed for comparison. CuAl2 can be a good choice in terms of liner-free and barrier-free interconnections having a low resistivity and a good TDDB and EM reliability.