Reduction of Ag Corrosion Rate During Decapsulation of Ag Wire Bond Packages

Abstract

Ag wire-bonded packages have gained a lot of interest as a low-cost substitute material in lieu of Au wire-bonded packages. However, selective decapsulation still remains as challenges due to a corrosion on Ag wires, where Ag has a strong tendency to form a water-soluble Ag salt upon reaction with a conventional nitric acid etchant. This paper serves to present a chemical solution that can reduce corrosion on Ag wires during decapsulation process of the Ag wire-bonded packages. Also, our method is applicable for industry standard needs such as for decapsulation at high temperature.