The continued development of multilayered and compositionally modulated electrodeposits

F. C. Walsh
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引用次数: 3

Abstract

ABSTRACT Traditionally, electroplating has involved the continuous deposition of a single layer of metal at constant current. However, electrodeposition of alternate layers can offer benefits such as reduced wear, improved corrosion resistance and higher tensile strength. The alternate layers can involve different morphology or thickness of metal, different metals or the alloy composition of layers with and without included particles. In the case of a single bath, electrocrystallisation is continuous but layers can be tailored to have different chemical composition, phase composition, morphology and microstructure. The composition of layers can also be systematically modified in a gradient fashion. The thickness of each metal layer can vary from >20 μm down to ≈1 nm; in the case of nanometre thick layers, up to 500 layers of 1 nm thick individual layers might be involved. Compact multilayer deposition from a single bath is often achieved by applying a potential waveform in the laboratory or pulsed current in industry. While multilayer electrodeposition is going through a phase of rediscovery, growth and diversification, the field can be traced back to a patent involving Cu–Ni multilayers, in 1905. Progress in multi-layered electrodeposition has made use of contemporary trends in electroplating research, including self-assembled layers, nanowire arrays and the use of deep eutectic solvents for electrolytes. The developing uses of multilayer deposits are seen to span industries as diverse as wear and corrosion resistant coatings, tool bits and heavy engineering. Speciality uses include electronic, optical and magnetic materials as well as catalytic electrode surfaces for electrochemical technology. Recommendations are made for topics which deserve further R & D.
多层和成分调制的电沉积的持续发展
传统上,电镀涉及在恒定电流下连续沉积单层金属。然而,电沉积替代层可以提供诸如减少磨损,提高耐腐蚀性和更高的抗拉强度等优点。交替层可以涉及不同的金属形态或厚度,不同的金属或层的合金组成,包括或不包括颗粒。在单浴的情况下,电结晶是连续的,但层可以定制为具有不同的化学成分,相组成,形态和微观结构。层的组成也可以以梯度方式系统地修改。每个金属层的厚度从>20 μm到≈1 nm不等;在纳米厚层的情况下,可能涉及多达500层1纳米厚的单个层。在实验室中,通过施加电位波形或在工业中施加脉冲电流,通常可以从单个镀液中获得紧凑的多层沉积。虽然多层电沉积正在经历一个重新发现、发展和多样化的阶段,但该领域可以追溯到1905年一项涉及Cu-Ni多层电沉积的专利。多层电沉积的进展利用了当代电镀研究的趋势,包括自组装层、纳米线阵列和使用深共晶溶剂作为电解质。多层沉积材料的发展用途被认为涵盖了各种行业,如耐磨和耐腐蚀涂层、刀具和重型工程。特殊用途包括电子,光学和磁性材料以及电化学技术的催化电极表面。对值得进一步研发的课题提出了建议。
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