CiB(Chip in Board) Optical Engine Module Using Advanced Fan-Out Package Technology

Abstract

In this paper, the development of a new optical chip in board (CiB) package adapting Fan-out technology that offers thermal, electrical and thin structure benefit was reported. Optical CiB package contain 4 optical die and is made smaller and thinner than market with the redistribution layer technology of FO-WLP. The key advantages such as high production yield, low cost and simple process steps surpass the conventional optical packages that depends on high precision alignment but always difficult to achieve good performance. Through finally demonstrated that communication is possible at the target speed of 10Gbps/Ch through actual measurement. In this paper describes the structural features of Embedded optical CiB package with integration of nepes'Fan-out technology.