Introducing Purion H, a scanned spot beam high current ion implanter

B. Vanderberg, Patrick Heres, E. Eisner, B. Libby, Joseph Valinski, W. Huff
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引用次数: 4

Abstract

As a member of the Purion ion implanter family, Purion H is Axcelis' next generation high current implanter. Purion H provides customers with an unprecedented level of process flexibility and yield-enabling technology, and features the platform's four common differentiators: Purion Contamination Shield™, Purion Vector™ Dose and Angle Control System, Purion 500 wafer/hour endstation and the Eterna™ ELS source. Like Purion M and Xe, Purion H uses a hybrid scan architecture. Its scanned spot beam technology delivers precise dosage, angle and dose rate on all points of the wafer, by permitting simultaneous and independent implant uniformity and angle control. Purion H high also comprises a five-filter beamline to deliver beam purity for low variability and defects: a series of dipole magnets and a deflecting energy filter separate unwanted contaminants from the ion beam. Magnetic beam scanning permits space-charge neutralization of high beam currents, resulting in high productivity via high beam currents in combination with short tune times and a fast 500 wafer/hour end station. Other new features include a maintenance friendly, integrated source extraction system; a novel uniformity correction algorithm; a new, higher output microwave PEF powered by a solid-state amplifier for metals-free charge neutralization of high current beams; and advanced beam diagnostics to quantify average angles and spread of the scanned spot beam. Finally, the dosimetry system, which is common to the Purion M medium current implanter, extends the application space of Purion H beyond the traditional coverage of high current implanters down to doses <; 2e11 /cm2, enabling new applications while maintaining productivity.
介绍Purion H型扫描点束大电流离子注入器
作为Purion ion植入器家族的一员,Purion H是Axcelis公司的下一代高电流植入器。Purion H为客户提供了前所未有的工艺灵活性和产量支持技术,并具有平台的四个常见区别:Purion污染屏蔽™,Purion矢量剂量和角度控制系统,Purion 500晶片/小时终端和Eterna™ELS源。像Purion M和Xe一样,Purion H使用混合扫描架构。其扫描点光束技术通过允许同时和独立的植入均匀性和角度控制,在晶圆片的所有点上提供精确的剂量,角度和剂量率。Purion H high还包括一个五滤光束线,以提供低变异性和缺陷的光束纯度:一系列偶极磁铁和偏转能量过滤器将不需要的污染物从离子束中分离出来。磁束扫描允许高光束电流的空间电荷中和,从而通过高光束电流结合短调谐时间和快速500晶片/小时的端站实现高生产率。其他新功能包括维护友好,集成源提取系统;一种新的均匀性校正算法;由固态放大器驱动的新型高输出微波PEF,用于大电流光束的无金属电荷中和;先进的光束诊断,量化扫描点光束的平均角度和扩散。最后,Purion M中电流植入器通用的剂量测定系统,将Purion H的应用空间从传统的大电流植入器的覆盖范围扩展到剂量<;2e11 /cm2,在保持生产力的同时支持新的应用程序。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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