Study on an Improved Wafer Level Fabrication Process to Achieve Size Uniformity for Micro Glass Shell Resonators

Zhaoxi Su, J. Shang, Bin Luo, C. Wong
{"title":"Study on an Improved Wafer Level Fabrication Process to Achieve Size Uniformity for Micro Glass Shell Resonators","authors":"Zhaoxi Su, J. Shang, Bin Luo, C. Wong","doi":"10.1109/ECTC.2018.00147","DOIUrl":null,"url":null,"abstract":"The size of the 3D micro glass shell resonator is one of the main factors affecting the performance of the micro shell resonator gyroscopes (µSRG) such as resonant frequency and quality factor. Different sizes result in different resonant frequencies, which will directly affect the performance of the µSRG. Therefore, for wafer-level fabrication process of micro shell resonators, ensuring size uniformity is an important issue that must be considered. The original wafer-level method for the preparation of micro shell resonators - chemical foaming process (CFP), cannot guarantee that all the resonators on the wafer have the same size. In this paper, an improved process is investigated to improve size uniformity of wafer level shell resonators. Through the measurement, the standard deviation of the height of micro shell resonators on the wafer is reduced from 0.12 to 0.08, and the range is reduced from 480µm to 350µm. The improved process shows potential for improving size uniformity.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"58 1","pages":"962-966"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2018.00147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The size of the 3D micro glass shell resonator is one of the main factors affecting the performance of the micro shell resonator gyroscopes (µSRG) such as resonant frequency and quality factor. Different sizes result in different resonant frequencies, which will directly affect the performance of the µSRG. Therefore, for wafer-level fabrication process of micro shell resonators, ensuring size uniformity is an important issue that must be considered. The original wafer-level method for the preparation of micro shell resonators - chemical foaming process (CFP), cannot guarantee that all the resonators on the wafer have the same size. In this paper, an improved process is investigated to improve size uniformity of wafer level shell resonators. Through the measurement, the standard deviation of the height of micro shell resonators on the wafer is reduced from 0.12 to 0.08, and the range is reduced from 480µm to 350µm. The improved process shows potential for improving size uniformity.
实现微玻璃壳谐振器尺寸均匀性的改进晶圆级制造工艺研究
三维微玻璃壳谐振器的尺寸是影响微壳谐振陀螺仪(µSRG)谐振频率和质量因子等性能的主要因素之一。不同的尺寸导致不同的谐振频率,这将直接影响µSRG的性能。因此,在微壳谐振器的晶圆级制造工艺中,保证尺寸均匀性是必须考虑的重要问题。原晶圆级制备微壳谐振器的方法——化学发泡法(CFP),不能保证晶圆上所有的谐振器具有相同的尺寸。本文研究了一种改善晶圆级壳腔尺寸均匀性的改进工艺。通过测量,微壳谐振器在晶圆上的高度标准差从0.12减小到0.08,范围从480µm减小到350µm。改进后的工艺显示出改善尺寸均匀性的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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