A study on the nitridation of barrier liner contribution to galvanic corrosion of copper bondpad

Xiaodong Li, R. Chockalingam, P. Ang, W. Neo, Juan Boon Tan
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Abstract

Galvanic corrosion of copper bondpad is studied with various copper barrier liner compositions in a unbiased highly accelerated stress test (uhast) condition. It is observed that the delamination at the bimetallic interface between the barrier liner and bulk copper has a strong dependence of N/Ta ratio of the liner. The delamination mechanism is explained and attributed to the galvanic corrosion, due to the presence of electrochemical potential difference between the barrier liner and bulk copper, which is shown to be significantly suppressed by increasing the nitrogen content composition of the liner.
阻挡层氮化对铜焊盘电偶腐蚀的影响研究
在无偏高加速应力试验(uhast)条件下,研究了不同铜屏障衬里成分对铜键合垫的电偶腐蚀。研究发现,阻挡衬里与大块铜双金属界面处的分层现象与衬里的N/Ta比有很强的相关性。解释了分层机制,并将其归因于电偶腐蚀,这是由于屏障衬里和大块铜之间存在电化学电位差,而增加衬里的氮含量成分可以显著抑制这种电位差。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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