Single/few-layer boron nitride-based nanocomposites for high thermal conductivity underfills

Ziyin Lin, Yagang Yao, A. McNamara, K. Moon, C. Wong
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引用次数: 15

Abstract

Thermal management in 3D packaging plays an important role in the device performance and reliability. The development of thermally conductive underfills is highly crucial, but still challenging. In this work, single/few-layer boron nitride (BN) was exfoliated from bulk h-BN flakes and was incorporated into epoxy resin via a solvent transfer method. [1] The structure of exfoliated BN was characterized by varieties of techniques, including scanning electron microscopy, transmission electron microscopy, electron diffraction, Raman microscopy, and UV-vis microscopy. The single/few layer boron nitride/epoxy composite was characterized by thermomechanical analysis and thermogravimetric analysis. The thermal conductivity of exfoliated BN was measured by an infrared thermal imaging method. A significant enhancement of thermal conductivity (220%) is observed at a low filler loading of 5 wt%, indicating that the single/few-layer BN is a promising filler for the development of novel underfill for 3D packaging.
用于高导热下填料的单/少层氮化硼纳米复合材料
3D封装中的热管理对器件的性能和可靠性起着重要的作用。导热下填料的开发是非常重要的,但仍然具有挑战性。本研究将单层/多层氮化硼(BN)从h-BN薄片中剥离,并通过溶剂转移法将其掺入环氧树脂中。[1]通过扫描电镜、透射电镜、电子衍射、拉曼显微镜、紫外-可见显微镜等多种技术表征了剥离BN的结构。采用热力学分析和热重分析对单层/多层氮化硼/环氧复合材料进行了表征。用红外热成像方法测定了剥离BN的热导率。在5 wt%的低填充量下,观察到导热性显著增强(220%),表明单层/多层BN是开发新型3D封装下填料的有前途的填料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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