Interconnection requirements and multi-die integration for FPGAs

Abstract

Die stacking technology with high-density interconnect is enabling new product architectures and capabilities. Silicon interposer based stacking with through silicon via (TSV) has gained traction for high-performance applications. Some of the challenges in manufacturing technology, supply-chain strategy, design tools and infrastructure are being addressed to enable broader technology adoption. This paper provides an overview of Field Programmable Gate Array (FPGA) application trends which are driving the need for advanced die-stacking technologies. We present design and manufacturing considerations for stacking technologies and highlight lessons learned from a recent technology demonstration vehicle.