Fast Finite Element Modeling Method for TSV Interposer on Specially Developed SAAS Cloud

Xiaodong Wu, Shengli Ma
{"title":"Fast Finite Element Modeling Method for TSV Interposer on Specially Developed SAAS Cloud","authors":"Xiaodong Wu, Shengli Ma","doi":"10.1109/EPTC50525.2020.9315110","DOIUrl":null,"url":null,"abstract":"The coupled thermo-mechanical field analysis of TSV interposer is a typical multiscale simulation problem, it faces great difficulty of numerous TSVs and complex micro structures. To get balance between accuracy and efficiency, global/local finite element (GLFE) strategy often be used in the multiscale coupled field analysis. In steps of the GLFE strategy, global coarse mesh evaluation plays the key role and the mesh model of this step determines the calculation effect. Currently, finite element modeling for TSV interposer is mostly finished manually with the help of comprehensive finite element software. To improve the laboriously and time-consuming manual modeling procedures, a finite element modeling method specifically oriented for TSV interposer is proposed. The modeling method is an imitation of fabrication procedures, it consists of layer based geometry modeling, parametric meshing, automatic contact detection, automatic boundary condition building and automatic loading processes. TSV discretization methods affected the quality of the mesh model directly, 4 kinds of TSV discretization methods are proposed in this paper, namely: Fine Mesh Method, Single Point Method, Single Mesh Method and Equivalent Model Method, they reach different equilibrium points on model size and accuracy, feeding need of different simulation scenarios. As the implementation of the modeling method a SAAS cloud system is built, the system run in B/S mode and it can make the modeling procedures easier. Finally, with the help of the modeling method and the SAAS cloud system, a thermo-mechanical analysis of TSV interposer based 2.5D RF module is done. The comparison of the time consumption and results with comprehensive finite element software ANSYS Workbench indicates that the cloud system can get great efficiency with enough accuracy.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"10 1","pages":"273-280"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC50525.2020.9315110","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The coupled thermo-mechanical field analysis of TSV interposer is a typical multiscale simulation problem, it faces great difficulty of numerous TSVs and complex micro structures. To get balance between accuracy and efficiency, global/local finite element (GLFE) strategy often be used in the multiscale coupled field analysis. In steps of the GLFE strategy, global coarse mesh evaluation plays the key role and the mesh model of this step determines the calculation effect. Currently, finite element modeling for TSV interposer is mostly finished manually with the help of comprehensive finite element software. To improve the laboriously and time-consuming manual modeling procedures, a finite element modeling method specifically oriented for TSV interposer is proposed. The modeling method is an imitation of fabrication procedures, it consists of layer based geometry modeling, parametric meshing, automatic contact detection, automatic boundary condition building and automatic loading processes. TSV discretization methods affected the quality of the mesh model directly, 4 kinds of TSV discretization methods are proposed in this paper, namely: Fine Mesh Method, Single Point Method, Single Mesh Method and Equivalent Model Method, they reach different equilibrium points on model size and accuracy, feeding need of different simulation scenarios. As the implementation of the modeling method a SAAS cloud system is built, the system run in B/S mode and it can make the modeling procedures easier. Finally, with the help of the modeling method and the SAAS cloud system, a thermo-mechanical analysis of TSV interposer based 2.5D RF module is done. The comparison of the time consumption and results with comprehensive finite element software ANSYS Workbench indicates that the cloud system can get great efficiency with enough accuracy.
基于SAAS云的TSV中介器快速有限元建模方法
TSV中间层的热-力耦合场分析是一个典型的多尺度模拟问题,其难点在于TSV数量多、微观结构复杂。为了在精度和效率之间取得平衡,在多尺度耦合场分析中经常采用全局/局部有限元策略。在GLFE策略的各个步骤中,全局粗网格评估起着关键作用,该步骤的网格模型决定了计算效果。目前,TSV中间层的有限元建模大多是借助综合有限元软件手工完成的。为了改进手工建模的繁琐和耗时,提出了一种专门针对TSV中间体的有限元建模方法。建模方法是一种模拟加工过程的方法,它包括基于层的几何建模、参数化网格划分、自动接触检测、自动边界条件建立和自动加载过程。TSV离散化方法直接影响网格模型的质量,本文提出了4种TSV离散化方法,即:细网格法、单点法、单网格法和等效模型法,它们在模型尺寸和精度上达到不同的平衡点,满足不同仿真场景的进料需求。作为建模方法的实现,构建了一个SAAS云系统,系统以B/S模式运行,使建模过程更加简单。最后,借助建模方法和SAAS云系统,对基于TSV中间层的2.5D射频模块进行了热力学分析。与综合有限元软件ANSYS Workbench的耗时和结果对比表明,该云计算系统能够在获得足够精度的前提下获得较高的效率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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