T. Tian, Kai Chen, Martin Kunz, Nobumichi Tamura, C. Zhan, Tao-Chih Chang, K. Tu
{"title":"Preferred orientation of 30 μm fine pitch Sn2.5Ag micro-bumps studied by synchrotron polychromatic x-ray Laue microdiffraction","authors":"T. Tian, Kai Chen, Martin Kunz, Nobumichi Tamura, C. Zhan, Tao-Chih Chang, K. Tu","doi":"10.1109/ECTC.2012.6248938","DOIUrl":null,"url":null,"abstract":"Synchrotron radiation white beam x-ray microdiffraction was employed to study grain size and orientation of fine pitch Sn2.5Ag micro-bumps. The indexing of the Laue patterns shows that there is mostly one dominant grain orientation in each micro-bump. Moreover, a statistics study based on the characterization of 72 micro-bumps, shows that the [001] direction, which is the fast diffusion path for Ni/Cu atoms in Sn tends to be parallel to the substrate of the test vehicle. This property remains stable after repeated reflow processes.","PeriodicalId":6384,"journal":{"name":"2012 IEEE 62nd Electronic Components and Technology Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 62nd Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2012.6248938","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Synchrotron radiation white beam x-ray microdiffraction was employed to study grain size and orientation of fine pitch Sn2.5Ag micro-bumps. The indexing of the Laue patterns shows that there is mostly one dominant grain orientation in each micro-bump. Moreover, a statistics study based on the characterization of 72 micro-bumps, shows that the [001] direction, which is the fast diffusion path for Ni/Cu atoms in Sn tends to be parallel to the substrate of the test vehicle. This property remains stable after repeated reflow processes.