bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI:10.1109/EPTC50525.2020.9315083

L. Lois, Tee Weikok, Yu Minglang, Wang Bisheng, Zhang Xi, Yee Boonhwa, Li Xiaomin, H. Younan

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引用次数: 2

Abstract

Wire bond is the most common inter-connection method used to connect microchips to the terminals of a chip package. Wire bond reliability is vital to the performance of packaging device. It is vital to understand the reliability performance of different wire types under the environment of temperature, moisture and voltage bias. In this study, copper (Cu), palladium coated copper (PdCu) and silver (Ag) wires were boned to aluminum (Al) bond pad. Chlorine (Cl) and sulfur (S) contaminations were purposely introduced to epoxy molding compound (EMC) to accelerate the corrosion process. Reliability tests bHAST (biased highly accelerated stress test), pressure cooker test (PCT) and temperature cycle test (TCT) were conducted. The results showed that bHAST encountered most failures, followed by PCT. Whilst TCT encountered no failure. For the wire type, PdCu-75%Pd coverage showed the best reliability performance among all the legs. For the EMC contamination type, Cl played a significant role on wire bond reliability. Whilst, S did not impact much on wire bond reliability.

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Cu-Al、PdCu-Al、Ag-Al的bast、PCT、TCT可靠性性能比较

线键是将微芯片连接到芯片封装的终端的最常用的互连方法。焊丝粘合的可靠性对封装装置的性能至关重要。了解不同导线在温度、湿度和电压偏置环境下的可靠性性能是至关重要的。在本研究中，将铜(Cu)、钯包覆铜(PdCu)和银(Ag)导线连接到铝(Al)键垫上。有针对性地将氯(Cl)和硫(S)污染引入环氧成型化合物(EMC)中，以加速其腐蚀过程。可靠性试验进行了偏置高加速应力试验(bast)、高压锅试验(PCT)和温度循环试验(TCT)。结果显示，bast失败最多，其次是PCT，而TCT没有失败。对于线材类型，PdCu-75%Pd覆盖率在所有支腿中表现出最佳的可靠性性能。对于电磁兼容污染类型，Cl对导线键合可靠性有显著影响。而S对线键可靠性影响不大。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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