W. Hackenberger, N. Kim, C. Randall, W. Cao, T. Shrout, D.P. Pickrell
{"title":"Processing and structure-property relationships for fine grained PZT ceramics","authors":"W. Hackenberger, N. Kim, C. Randall, W. Cao, T. Shrout, D.P. Pickrell","doi":"10.1109/ISAF.1996.598172","DOIUrl":null,"url":null,"abstract":"Submicron grain sized PZT-5A ceramics have been produced with properties comparable to conventional coarse grained material. The degradation in dielectric and piezoelectric properties with decreasing grain size was compensated with a new dopant strategy. This made the materials piezoelectrically softer compensating for reductions in poling efficiency. The submicron grain sized material has been shown to be superior to coarse grained ceramic during fine scale dicing operations.","PeriodicalId":14772,"journal":{"name":"ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics","volume":"46 1","pages":"903-906 vol.2"},"PeriodicalIF":0.0000,"publicationDate":"1996-08-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAF.1996.598172","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
Submicron grain sized PZT-5A ceramics have been produced with properties comparable to conventional coarse grained material. The degradation in dielectric and piezoelectric properties with decreasing grain size was compensated with a new dopant strategy. This made the materials piezoelectrically softer compensating for reductions in poling efficiency. The submicron grain sized material has been shown to be superior to coarse grained ceramic during fine scale dicing operations.